Reactive nanofoils represent an innovative joining technology that creates consistent bonds within milliseconds with extremely low and localized heat input, enabling novel soldering and joining processes.
Your advantages when joining with nanofoils
Your advantages by working with innojoin:
Reactive nanofoils represent an innovative joining technology that creates consistent bonds within milliseconds with extremely low and localized heat input, enabling novel soldering and joining processes
Reactive nanofoils are characterized by the fact that they consist of hundreds, sometimes up to a few thousand layers. These so-called NanoFoils® are composed of alternately applied 25 to 90 nm thick Al or Ni layers and have a total thickness between 40 and 80 μm as standard. For research purposes (eg brazing processes) nanofoils with thicknesses of 100, 125, 150, 200 and 250 μm can also be produced. On the basis of a self-propagating exothermic reaction, a nanofilm can, depending on the film thickness, selectively achieve locally limited temperatures of over 1000 ° C. at the joint, without the material properties of the component being changed. By varying the thickness and composition of the films or layers, the temperature, the speed and the absolute energy of the joining process can be controlled. The Al-Ni multi-layer system is currently the most widely used. The reason for this is the ease of handling and the high stability during the manufacturing process, these are usually the methods of magnetron sputtering (MSD) and higher energy ion beam sputtering (IBSD). Deposited Al-Ni multilayers are very stable and reproducible in terms of their ignition properties. The reaction itself is activated (ignited) by a short energy input and proceeds on its own.
After the reaction, the film is present as an intermetallic, solid phase in the reaction zone. The pressure prevailing in the joining zone and the brittleness of the intermetallic phase often lead to breaks in the nanofoil, which allows mixing of the solder in the joining zone.