Reactive-Nanofoil

 

 

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Reactive Nanofoil

Reactive nanofoils represent an innovative joining technology that creates consistent bonds within milliseconds with extremely low and localized heat input, enabling novel soldering and joining processes.

Your advantages when joining with nanofoils

  • Joining at room temperature: No heating of the components by the local heat source in contrast to standard soldering, such. B. reflow soldering
  • No structural changes in the base material due to the low energy input
  • Minimal thermal influence on temperature-sensitive components, since the heat only acts for a short time
  • Low-stress connection of materials with significantly different thermal expansion coefficients possible (eg aluminum / steel, ceramic / steel, glass / copper)
  • Flux-free process, d. H. no organic residues on the substrates
  • Process flexibility: Degrees of freedom in solder selection and process sequence
  • Extremely fast and precise joining
  • Flat connection with good thermal and electrical conductivity
  • No outgassing and no aging in the joining zone
  • Joining process in vacuum possible because no oxygen is needed
  • Use of quality assurance procedures such as ultrasound and computed tomography possible
  • High joint quality due to very low error rates (<2%)

Your advantages by working with innojoin:

  • Detailed application analysis
  • Process development (if necessary)
  • Prototype and serial production
  • Series introduction at the customer
  • Reliable delivery and laser-based fabrication of nanofoils basics

Reactive nanofoils represent an innovative joining technology that creates consistent bonds within milliseconds with extremely low and localized heat input, enabling novel soldering and joining processes

Reactive nanofoils are characterized by the fact that they consist of hundreds, sometimes up to a few thousand layers. These so-called NanoFoils® are composed of alternately applied 25 to 90 nm thick Al or Ni layers and have a total thickness between 40 and 80 μm as standard. For research purposes (eg brazing processes) nanofoils with thicknesses of 100, 125, 150, 200 and 250 μm can also be produced. On the basis of a self-propagating exothermic reaction, a nanofilm can, depending on the film thickness, selectively achieve locally limited temperatures of over 1000 ° C. at the joint, without the material properties of the component being changed. By varying the thickness and composition of the films or layers, the temperature, the speed and the absolute energy of the joining process can be controlled. The Al-Ni multi-layer system is currently the most widely used. The reason for this is the ease of handling and the high stability during the manufacturing process, these are usually the methods of magnetron sputtering (MSD) and higher energy ion beam sputtering (IBSD). Deposited Al-Ni multilayers are very stable and reproducible in terms of their ignition properties. The reaction itself is activated (ignited) by a short energy input and proceeds on its own.

After the reaction, the film is present as an intermetallic, solid phase in the reaction zone. The pressure prevailing in the joining zone and the brittleness of the intermetallic phase often lead to breaks in the nanofoil, which allows mixing of the solder in the joining zone.

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